In the traditional LED lighting field, heat dissipation has always been a key factor limiting performance improvement. Especially with the rapid development of LED technology toward high light efficiency and high power, high-power LED packaging technology, due to its structural and process complexities, directly affects the performance and lifespan of LEDs.
In high-power LED applications, poor heat dissipation leads to intensified light decay, reduced stability, and other issues, which have become urgent problems for the industry to address.
To address the pain points of traditional high-power packaging products, Refond Optoelectronics has innovatively adopted diamond substrate technology and launched a breakthrough high-power LED package—the diamond-based ultra-high-power density package. This new product meets the demand for high-power LEDs in scenarios such as automotive headlights, outdoor high-intensity lighting, and stage lighting, opening up more possibilities for the development and application of high-power LEDs.
In high-power application scenarios such as automotive headlights, conventional ceramic materials often suffer from severe light decay, shortened lifespan, or even burnout due to poor heat dissipation. Refond Optoelectronics innovatively uses diamond materials for the substrate, with a thermal conductivity of up to 1800W/(m·K), which is 10 times that of ceramic materials. This enables brightness to continuously increase under high power, while allowing the LED chip to operate stably at higher powers.
The new product offers multiple specification options, with the smallest single lamp size down to 5*5mm, which is highly compatible with the mainstream market specifications and can directly replace existing solutions. This effectively reduces maintenance costs and meets the needs of applications requiring high light efficiency, particularly suitable for scenarios such as street lighting, which require high brightness and long-duration illumination.
In terms of optical performance, Refond Optoelectronics has designed the diamond-based substrate packaging structure to significantly reduce light loss during propagation. Single-lamp power can achieve 60W with light flux exceeding 6500lm, and the light distribution is brighter and more uniform, demonstrating excellent optical performance in scenarios such as projectors, which require high brightness and high uniformity.
Diamond material has a small coefficient of thermal expansion, which can reduce thermal stress caused by temperature changes, preventing issues such as cracks or peeling. Refond Optoelectronics' diamond-based ultra-high-power density packaging, using its proprietary advanced packaging technology, effectively improves the reliability, stability, and lifespan of the devices. This feature is especially important in professional lighting scenarios such as stage lighting, where it ensures the equipment maintains good performance even under high-intensity operation.
The launch of the new diamond-based ultra-high-power density packaging is undoubtedly a major breakthrough in the lighting field. It has brought a qualitative improvement to current lighting applications and will inject new vitality into the development of high-end lighting applications. It is gradually demonstrating great potential in applications such as outdoor lighting, automotive lighting, drone lighting, projectors, and stage lighting.
Refond Optoelectronics will continue to drive product upgrades and iterations based on innovations in ultra-high-power density packaging technology, further enhancing the competitiveness of Refond Optoelectronics products to meet the market's diverse application needs for high light-efficiency and high-performance LED light sources.
