A high power CSP LED is a flip-chip device that offers high drive current capability in a footprint marginally larger than its light-emitting stack. The fundamental packaging philosophy of chip-scale LED packages is to strip off superfluous package elements without compromising both thermal performance and the SMT advantages made possible with standardized packaging. In addition to significantly scaling down the package size, the CSP platform provides the benefits of greatly reduced junction-to-board thermal resistance, enhanced electrical connectivity and interconnect reliability, and a substantial reduction in material and manufacturing costs. With performance and robustness comparable to the more costly ceramic-based high power LED packages, CSP LEDs are at the heart of recent innovation in the lighting industry. CSP technology has made its way into an extensive array of applications, including high bay lighting, roadway lighting, architectural lighting, automotive front lighting, etc.
at the Open Lighting Product Directory (OLPD)
