A mid-power CSP LED is a flat no-lead semiconductor emitter package that is constructed without using a lead frame and has both p-type and n-type electrical contacts on the bottom of the LED die. This type of LED package is designed as a lower-cost but higher-performance alternative to traditional plastic leaded chip carrier (PLCC) LEDs that operate at a low wattage (1 W max.). CSP LEDs are built around a flip-chip architecture which affords the lighting industry the opportunity to reduce both manufacturing and material costs while advancing the performance and reliability of the products to a new level. Chip-scale packages are invented with a philosophy to strip out as many of the superfluous package elements as possible. Along with the cost benefit are minimized thermal resistance, minimized length of the thermal path, maximized effective surface area for current and heat spreading, and a smaller footprint that enables unprecedented design freedom in optical control and new lighting form factors.